Microwave and millimeter-wave electronic packaging

This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs.

Bibliographic Details

Main Author:	Sturdivant, Rick (Author)
Format:	Book
Language:	English
Published:	Boston, MA Artech House 2014
Subjects:	Microelectronic packaging.
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