APA (7th ed.) Citation

Lau lhJohn H. Low cost flip chip technologies: For DCA, WLSCP and PBGA assemblies.

Chicago Style (17th ed.) Citation

Lau lhJohn H. Low Cost Flip Chip Technologies: For DCA, WLSCP and PBGA Assemblies. New York lbMcGraw-Hill lc2000.

MLA (9th ed.) Citation

Lau lhJohn H. Low Cost Flip Chip Technologies: For DCA, WLSCP and PBGA Assemblies.

Warning: These citations may not always be 100% accurate.