Low cost flip chip technologies for DCA, WLSCP and PBGA assemblies
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| Format: | Book |
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New York lbMcGraw-Hill lc2000
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| Subjects: | |
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| Item Description: | Includes bibliographical references and index |
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| Physical Description: | xxii,585p. ill 23.5cm |
| ISBN: | 0071351418 |