Low cost flip chip technologies for DCA, WLSCP and PBGA assemblies
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| Format: | Book |
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New York lbMcGraw-Hill lc2000
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|---|---|---|---|
| 001 | 15052 | ||
| 003 | MY-KLNDU | ||
| 005 | 20241218060229.0 | ||
| 020 | 0 | 0 | |a 0071351418 |
| 035 | |a 0000007065 | ||
| 039 | 9 | |y 200910081627 |z VLOAD | |
| 090 | 0 | 0 | |a TK7874. |b L3168 2000 |
| 100 | 1 | 0 | |a Lau lhJohn H. |
| 245 | 1 | 0 | |a Low cost flip chip technologies |b for DCA, WLSCP and PBGA assemblies |c John H. Lau |
| 260 | 0 | 0 | |a New York lbMcGraw-Hill lc2000 |
| 300 | |a xxii,585p. |b ill |c 23.5cm | ||
| 500 | 0 | 0 | |a Includes bibliographical references and index |
| 650 | 0 | 0 | |a Multichip modules |x microelectronics |
| 650 | 0 | 0 | |a microelectronics packing |
| 999 | |a vtls000014688 |c 15052 |d 15052 | ||