Flip chip technologies
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| Format: | Book |
| Published: |
New York lbMcGraw-Hill lc1996
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| Series: | Electronic packaging and interconnection series
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| Subjects: | |
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| 039 | 9 | |y 200910091017 |z VLOAD | |
| 090 | 0 | 0 | |a TK 7874 |b F5897 1995 |
| 245 | 1 | 0 | |a Flip chip technologies |c John H.Lau |
| 260 | 0 | 0 | |a New York lbMcGraw-Hill lc1996 |
| 300 | |a xxiv,565p |b ill |c 24cm | ||
| 440 | 0 | 0 | |a Electronic packaging and interconnection series |
| 500 | 0 | 0 | |a Includes bibliographical references and index |
| 650 | 0 | 0 | |a Microelectronic packaging |
| 650 | 0 | 0 | |a Multichip modules (microelectronics) |x design and construction |
| 700 | 1 | 1 | |a Lau |h John H |
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