APA (7th ed.) Citation

Harman, G. G. (1997). Wire bonding in microelectronics: Materials, processes, realibility and yield (2nd ed.). Mc Graw Hill.

Chicago Style (17th ed.) Citation

Harman, George G. Wire Bonding in Microelectronics: Materials, Processes, Realibility and Yield. 2nd ed. New York: Mc Graw Hill, 1997.

MLA (9th ed.) Citation

Harman, George G. Wire Bonding in Microelectronics: Materials, Processes, Realibility and Yield. 2nd ed. Mc Graw Hill, 1997.

Warning: These citations may not always be 100% accurate.