Wire bonding in microelectronics materials, processes, realibility and yield
The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics...
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| Main Author: | |
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| Format: | Book |
| Language: | English |
| Published: |
New York
Mc Graw Hill
1997
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| Edition: | 2nd ed. |
| Series: | .Electronic packaging and interconnection series.
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| Subjects: | |
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| Summary: | The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism. |
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| Item Description: | Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989. |
| Physical Description: | xiv, 290 p. ill. 24 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 0070326193 (hbk) |