Wire bonding in microelectronics materials, processes, realibility and yield
The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics...
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| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York
Mc Graw Hill
1997
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| Edition: | 2nd ed. |
| Series: | .Electronic packaging and interconnection series.
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| Subjects: | |
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| 100 | 1 | |a Harman, George G. | |
| 245 | 1 | 0 | |a Wire bonding in microelectronics |b materials, processes, realibility and yield |c George G. Harman |
| 250 | |a 2nd ed. | ||
| 260 | |a New York |b Mc Graw Hill |c 1997 | ||
| 300 | |a xiv, 290 p. |b ill. |c 24 cm. | ||
| 490 | 1 | |a Electronic packaging and interconnection series | |
| 500 | |a Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism. | ||
| 650 | 0 | |a Wire bonding (Electronic packaging) |x Production control. | |
| 650 | 0 | |a Electronic packaging |x Reliabiligy. | |
| 650 | 0 | |a electronic packaging |x defects. | |
| 650 | 0 | |a Semiconductors |x Failures. | |
| 830 | 0 | |a .Electronic packaging and interconnection series. | |
| 999 | |a vtls000002140 |c 2171 |d 2171 | ||