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Wire bonding in microelectronics materials, processes, realibility and yield

The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics...

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Bibliographic Details
Main Author: Harman, George G.
Format: Book
Language:English
Published: New York Mc Graw Hill 1997
Edition:2nd ed.
Series:.Electronic packaging and interconnection series.
Subjects:
Wire bonding (Electronic packaging) > Production control.
Electronic packaging > Reliabiligy.
electronic packaging > defects.
Semiconductors > Failures.
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