Wire bonding in microelectronics materials, processes, realibility and yield

The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics...

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Bibliographic Details

Main Author:	Harman, George G.
Format:	Book
Language:	English
Published:	New York Mc Graw Hill 1997
Edition:	2nd ed.
Series:	.Electronic packaging and interconnection series.
Subjects:	Wire bonding (Electronic packaging) > Production control. Electronic packaging > Reliabiligy. electronic packaging > defects. Semiconductors > Failures.
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