Integrated circuit failure analysis a guide to preparation techniques

The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right. The circuit designe...

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Bibliographic Details
Main Author: Beck, Friedrich
Format: Book
Language:English
Published: Chichester ; New York Wiley 1998.
Series:Wiley series in quality and reliability engineering
Subjects:
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040 |a UPNM 
090 |a TK 7871.852  |b .B43 1998 
100 1 |a Beck, Friedrich 
245 1 0 |a Integrated circuit failure analysis  |b a guide to preparation techniques  |c Friedrich Beck ; translated by Stephen S. Wilson. 
260 |a Chichester ;  |a New York  |b Wiley  |c 1998. 
300 |a xiv, 173 p  |b ill.  |c 24 cm. 
490 1 |a Wiley series in quality and reliability engineering 
500 |a "Revised edition of Präparationstechniken für die Fehleranalyse an integrierten Halbleiterschaltungen, VCH Verlagsgesellschaft mbH, 1988"--T.p. verso. 
504 |a Includes bibliographical references and index 
520 |a The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right. The circuit designer must constantly expand the range of analytical and preparative methods, adapting them to the needs of new technologies in order to successfully locate faults and ensure optimum quality. 
650 0 |a Semiconductors  |x Testing. 
650 0 |a Semiconductors  |x Failures. 
830 0 |a Wiley series in quality and reliability engineering 
999 |a vtls000000177  |c 257  |d 257