Introduction to system-on-package (SOP) miniaturization of the entire system
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| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
c2008.
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| Call Number : | TK7870.15 .T86 2008 |
MARC
| LEADER | 00000pam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | 27926 | ||
| 003 | MY-KLNDU | ||
| 005 | 20241218082425.0 | ||
| 008 | s2008 nyu d a 1 engdc | ||
| 020 | |a 0071459065 (alk. paper) | ||
| 020 | |a 9780071459068 (alk. paper) | ||
| 035 | |a 0000039538 | ||
| 039 | 9 | |a 201003171650 |b rahman |c 200911181300 |d VLOAD |y 200910091808 |z VLOAD | |
| 090 | |a TK7870.15 |b .T86 2008 | ||
| 100 | 1 | |a Tummala, Rao R., |d 1942- | |
| 245 | 1 | 0 | |a Introduction to system-on-package (SOP) |b miniaturization of the entire system |c Rao R. Tummala, Madhavan Swaminathan. |
| 260 | |a New York : |b McGraw-Hill, |c c2008. | ||
| 300 | |a xx, 785 p. : |b ill. ; |c 25 cm. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 591 | |a 0000010190 |b 11/06/09 |c 0200-07 |d 1 |e RM437.5 |f 1 |g 437.5 |h Harmoni Publications & Distributors Sdn. Bhd. | ||
| 650 | 0 | |a Multichip modules (microelectronics) |x design and construction. | |
| 650 | 0 | |a Microelectronic packaging. | |
| 700 | 1 | |a Swaminathan, Madhavan. | |
| 999 | |a vtls000037958 |c 27926 |d 27926 | ||