Optoelectronic packaging
The rapidly expanding field of packaging for optoelectronic devices challenges electrical engineers with a host of complex and daunting problems. The increasing intricacy of assemblage compounds the thorny interconnection issues associated with electronic packaging-how to assemble an array with many...
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| Other Authors: | , , |
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| Format: | Book |
| Language: | English |
| Published: |
New York, NY
John Wiley
1997
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| Series: | Wiley series in microwave and optical engineering
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| Subjects: | |
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| 090 | |a TA 1750 |b .O59 1997 | ||
| 245 | 0 | 0 | |a Optoelectronic packaging |c edited by Alan R. Mickelson, Nagesh R. Basavanhally, Yung-Cheng Lee |
| 260 | |a New York, NY |b John Wiley |c 1997 | ||
| 300 | |a xiii, 261 p. |b ill. |c 24 cm. | ||
| 490 | 1 | |a Wiley series in microwave and optical engineering | |
| 504 | |a Includes bibliographical reference and index | ||
| 505 | |a Communication system interconnection structure / Naoaki Yamanaka -- Long-distance interconnections : the fiber-optic network / Gary J. Grimes -- What a packaging engineer needs to know about optics / Felix Kapron and Robert Holland -- Semiconductor laser and optical amplifier packaging / Scott A. Merritt ... [et al.] -- Detector packaging / Laurence Watkins -- Waveguide technologies / Robert F. Feuerstein -- A review of passive device fabrication and packaging / Venkata A. Bhagavatula -- Array device packaging / Nagesh R. Basavanhally and Ronald A. Nordin -- Hybrid technology for optoelectronic packaging / Paul Haugsjaa -- Free-space optical interconnection for digital systems / John Neff -- Flip-chip assembly for smart pixel arrays / Y.C. Lee, Wei Lin, and Timothy McLaren. | ||
| 520 | |a The rapidly expanding field of packaging for optoelectronic devices challenges electrical engineers with a host of complex and daunting problems. The increasing intricacy of assemblage compounds the thorny interconnection issues associated with electronic packaging-how to assemble an array with many elements efficiently while maintaining thermal tolerance and simultaneously overcoming the ensuing modulation problems that generate electrical noise. Adding to these problems has been the absence, until now, of a single authoritative reference on the subject. | ||
| 650 | 0 | |a Optoelectronic devices | |
| 650 | 0 | |a Microelectronic packaging | |
| 650 | 0 | |a Integrated optics | |
| 700 | 1 | |a Mickelson, Alan R. | |
| 700 | 1 | |a Basavanhally, Nagesh R. | |
| 700 | 1 | |a Lee, Yung-Cheng | |
| 830 | 0 | |a Wiley series in microwave and optical engineering | |
| 999 | |a vtls000002848 |c 2918 |d 2918 | ||