Optoelectronic packaging
The rapidly expanding field of packaging for optoelectronic devices challenges electrical engineers with a host of complex and daunting problems. The increasing intricacy of assemblage compounds the thorny interconnection issues associated with electronic packaging-how to assemble an array with many...
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| Other Authors: | , , |
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| Format: | Book |
| Language: | English |
| Published: |
New York, NY
John Wiley
1997
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| Series: | Wiley series in microwave and optical engineering
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| Subjects: | |
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Table of Contents:
- Communication system interconnection structure / Naoaki Yamanaka
- Long-distance interconnections : the fiber-optic network / Gary J. Grimes
- What a packaging engineer needs to know about optics / Felix Kapron and Robert Holland
- Semiconductor laser and optical amplifier packaging / Scott A. Merritt ... [et al.]
- Detector packaging / Laurence Watkins
- Waveguide technologies / Robert F. Feuerstein
- A review of passive device fabrication and packaging / Venkata A. Bhagavatula
- Array device packaging / Nagesh R. Basavanhally and Ronald A. Nordin
- Hybrid technology for optoelectronic packaging / Paul Haugsjaa
- Free-space optical interconnection for digital systems / John Neff
- Flip-chip assembly for smart pixel arrays / Y.C. Lee, Wei Lin, and Timothy McLaren.