Optoelectronic packaging

The rapidly expanding field of packaging for optoelectronic devices challenges electrical engineers with a host of complex and daunting problems. The increasing intricacy of assemblage compounds the thorny interconnection issues associated with electronic packaging-how to assemble an array with many...

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Bibliographic Details

Other Authors:	Mickelson, Alan R., Basavanhally, Nagesh R., Lee, Yung-Cheng
Format:	Book
Language:	English
Published:	New York, NY John Wiley 1997
Series:	Wiley series in microwave and optical engineering
Subjects:	Optoelectronic devices Microelectronic packaging Integrated optics
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