Area array package design techniques in high-density electronics
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| Format: | Book |
|---|---|
| Published: |
New York
McGraw Hill
2004
|
| Series: | McGraw Hill engineering references guide series
|
| Subjects: | |
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| 245 | 1 | 0 | |a Area array package design |b techniques in high-density electronics |c Ken Gilleo editor |
| 260 | 0 | 0 | |a New York |b McGraw Hill |c 2004 |
| 300 | |a xii,204p. |b ill. |c 24cm | ||
| 440 | 0 | 0 | |a McGraw Hill engineering references guide series |
| 500 | 0 | 0 | |a Includes index |
| 650 | 0 | 0 | |a Electronic packaging |x design |
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