Advanced MEMS packaging
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| Other Authors: | |
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| Format: | Electronic eBook |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
c2010.
|
| Subjects: | |
| Online Access: | McGraw-Hill NetLibrary MyiLibrary ebrary |
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| 082 | 0 | 4 | |a 621.381/046 |2 22 |
| 245 | 0 | 0 | |a Advanced MEMS packaging |h [electronic resource] / |c John H. Lau ... [et al.]. |
| 260 | |a New York : |b McGraw-Hill, |c c2010. | ||
| 300 | |a 1 online resource (xxiii, 552 p.) : |b ill. | ||
| 500 | |a Description based on print version record. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. | |
| 650 | 0 | |a Microelectromechanical systems. | |
| 650 | 0 | |a Microelectronic packaging. | |
| 655 | 7 | |a Electronic books. |2 local | |
| 655 | 4 | |a Electronic books. | |
| 700 | 1 | |a Lau, John H. | |
| 776 | 0 | 8 | |i Print version: |t Advanced MEMS packaging. |d New York : McGraw-Hill, c2010 |z 9780071626231 |w (DLC) 2009040456 |w (OCoLC)277205716 |
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