Advanced MEMS packaging

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Bibliographic Details
Other Authors:	Lau, John H.
Format:	Electronic eBook
Language:	English
Published:	New York : McGraw-Hill, c2010.
Subjects:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Online Access:	McGraw-Hill NetLibrary MyiLibrary ebrary
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Call Number :	TK7875 .A378 2010

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