Photonic MEMS devices design, fabrication and control
by: Liu, Ai-Qun
Published: (2009)

Mems technology and devices Suntec, Singapore, 1-6 July 2007
Published: (2007)

An introduction to microelectromechanical systems engineering
by: Maluf
Published: (2004)

MEMS/MOEMS packaging concepts, designs, materials, and processes
by: Gilleo
Published: (2005)

Microwave and millimeter-wave electronic packaging
by: Sturdivant, Rick
Published: (2014)

Area array packaging processes for BGA, Flip Chip, and CSP
Published: (2004)

Microelectronics packaging handbook
Published: (1997)

Microelectronics packaging handbook
Published: (1997)

Introduction to system-on-package (SOP) miniaturization of the entire system
by: Tummala, Rao R., 1942-
Published: (2008)

Foundations of MEMS
by: Liu, Chang
Published: (2012)

Optoelectronic packaging
Published: (1997)

MEMS
by: Mahalik, N. P. (Nitaigour Premchand)
Published: (2007)

Pencirian antarasambungan pakej mikroelektronik terhadap keadaan sinar gamma terlampau
by: Wan Yusmawati Wan Yusoff
Published: (2014)

MEMS applications
Published: (2005)

Multichip modules systems advantages, major constructions, and materials technologies
Published: (1991)

Multichip modules systems advantages, major constructions, and materials technologies
Published: (1991)

Area array packaging materials adhesives, pastes and lead-free
by: Gilleo
Published: (2004)

BioMEMS
by: Urban
Published: (2006)

A guide to hands-on MEMS design and prototyping
by: Kubby, Joel A.
Published: (2011)

A guide to hands-on MEMS design and prototyping
by: Kubby, Joel A.
Published: (2011)

Multichip module technology handbook
by: Garrou
Published: (1998)

Electronic packaging, microelectronics, and interconnection dictionary
by: Harper, Charles A.
Published: (1993)

MEMS design and fabrication
Published: (2005)

Substrate integrated antennas and arrays
by: Cheng, Yu Jian
Published: (2016)

MEMS introduction and fundamentals
Published: (2005)

Packaging specifications, purchasing, and quality control
by: Leonard, Edmund A.
Published: (1987)

Packaging specifications, puchasing, and quality control
by: Leonard, Edmund A.
Published: (1996)

Low cost flip chip technologies for DCA,WLSCP,and PBGA assemblies
by: Lau
Published: (2000)

Flip chip technologies

Plastics in food packaging properties, design, and fabrication
by: Brown, William E.
Published: (1992)

Food packaging principles and practice
by: Robertson, Gordon L.
Published: (1993)

MEMS and microstructures in aerospace applications
by: Osiander

MEMS and microstructures in aerospace applications
by: Osiander
Published: (2005)

Microfabrication and nanomanufacturing
Published: (2006)

The Wiley encyclopedia of packaging technology
by: lh

The wiley encyclopedia of packaging technology
by: Brody
Published: (1997)