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Advanced MEMS packaging

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Bibliographic Details
Other Authors:	Lau, John H.
Format:	Electronic eBook
Language:	English
Published:	New York : McGraw-Hill, c2010.
Subjects:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Online Access:	McGraw-Hill NetLibrary MyiLibrary ebrary
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Table of Contents:

Enabling technologies for advanced MEMS packaging
Advanced MEMS wafer-level packaging
Optical MEMS packaging : communications
Optical MEMS packaging : bubble switch
Optical MEMS : microbolometer packaging
Bio-MEMS packaging
Biosensor packaging
Accelerometer packaging
Radiofrequency MEMS switches
RF MEMS tunable capacitors and tubable band-pass filters
Advanced packaging of RF MEMS devices.