Advanced Ta-based diffusion barriers for Cu interconnects
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| Main Author: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
New York :
Nova Science Publishers,
c2009.
|
| Subjects: | |
| Online Access: | NetLibrary |
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| Call Number : | TK7874.53 .H83 2009eb |
MARC
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| 007 | cr cnu---unuuu | ||
| 008 | 110210s2009 nyua ob 001 0 eng d | ||
| 020 | |a 9781607416753 (electronic bk.) | ||
| 020 | |a 1607416751 (electronic bk.) | ||
| 035 | |a (OCoLC)429997761 | ||
| 035 | |a (OCoLC)ocn429997761 | ||
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| 050 | 4 | |a TK7874.53 |b .H83 2009eb | |
| 082 | 0 | 4 | |a 621.3815 |2 22 |
| 100 | 1 | |a Hubner, Rene. | |
| 245 | 1 | 0 | |a Advanced Ta-based diffusion barriers for Cu interconnects |h [electronic resource] / |c Ren�e H�ubner. |
| 260 | |a New York : |b Nova Science Publishers, |c c2009. | ||
| 300 | |a 1 online resource (93 p.) : |b ill. | ||
| 500 | |a Description based on print version record. | ||
| 504 | |a Includes bibliographical references (p. [73]-86) and index. | ||
| 650 | 0 | |a Interconnects (Integrated circuit technology) | |
| 650 | 0 | |a Integrated circuits. | |
| 650 | 0 | |a Electrodiffusion. | |
| 655 | 7 | |a Electronic books. |2 local | |
| 776 | 0 | 8 | |i Print version: |a H�ubner, Ren�e. |t Advanced Ta-based diffusion barriers for Cu interconnects. |d New York : Nova Science Publishers, c2009 |z 9781604564518 |z 1604564512 |w (DLC) 2008008583 |w (OCoLC)192082716 |
| 856 | 4 | 0 | |3 NetLibrary |u http://www.netlibrary.com/urlapi.asp?action=summary&v=1&bookid=281179 |
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