Surface mount technology principles and practice
This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The author is a noted expert who is constantly in demand for training throughout the industry. The chapters are a walk-through of the actual assem...
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| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York, NY
Chapman & Hall
1997
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| Edition: | 2nd ed. |
| Subjects: | |
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| LEADER | 00000nam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | 4404 | ||
| 003 | MY-KLNDU | ||
| 005 | 20241218051648.0 | ||
| 008 | 140401 1997 nyua bi 000 0 eng d | ||
| 020 | |a 0412129213 | ||
| 039 | 9 | |a 201408211058 |b sani |c 201404011027 |d azraai |y 201404011026 |z azraai | |
| 040 | |a UPNM | ||
| 090 | |a TK 7868.P7 |b P7 1997 | ||
| 100 | 1 | |a Prasad, Ray P. | |
| 245 | 1 | 0 | |a Surface mount technology |b principles and practice |c Ray P. Prasad |
| 250 | |a 2nd ed. | ||
| 260 | |a New York, NY |b Chapman & Hall |c 1997 | ||
| 300 | |a xxvii, 772 p. |b ill. |c 24 cm. | ||
| 504 | |a Includes bibliographical references and index | ||
| 505 | |a Introduction to Surface Mount Technology -- Implementing SMT In-House and at Subcontractors -- Surface Mount Components -- Substrates for Surface Mounting -- Surface Mount Design Considerations -- Surface Mount Land Pattern Design -- Design for Manufacturability -- Adhesive and Its Application -- Solder Paste and Its Application -- Metallurgy of Soldering and Solderability -- Component Placement -- Soldering of Surface Mounted Components -- Flux and Cleaning -- Quality Control, Inspection, Repair, and Testing | ||
| 520 | |a This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The author is a noted expert who is constantly in demand for training throughout the industry. The chapters are a walk-through of the actual assembly process. A new chapter discusses the effect of high pin count devices (fine pitch, BGA, and PGA) and their impact on board assembly. Practicing engineers will use the new appendix of vendors for components, sockets, material processes, and equipment. Expanded coverage of water soluble paste, no clean paste, and lead free solder addresses the environmental issues new to this industry. | ||
| 650 | 0 | |a Surface mount technology | |
| 999 | |a vtls000051953 |c 4404 |d 4404 | ||