Handbook of electronic package design
Handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
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| Other Authors: | |
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| Format: | Book |
| Language: | English |
| Published: |
New York, NY
Marcel Dekker
1991
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| Series: | Mechanical engineering (Marcel Dekker, Inc.)
76 |
| Subjects: | |
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| 003 | MY-KLNDU | ||
| 005 | 20241218052020.0 | ||
| 008 | 140331 1991 nyua bi 000 0 eng d | ||
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| 039 | 9 | |a 201408220833 |b sani |y 201403311107 |z azraai | |
| 040 | |a UPNM | ||
| 090 | |a TK 7870.15 |b .H36 1991 | ||
| 245 | 0 | 0 | |a Handbook of electronic package design |c edited by Michael Pecht |
| 260 | |a New York, NY |b Marcel Dekker |c 1991 | ||
| 300 | |a xiii, 871 p. |b ill. |c 26 cm. | ||
| 490 | 1 | |a Mechanical engineering |v 76 | |
| 504 | |a Includes bibliographical references and index | ||
| 505 | |a Introduction -- Electronic components -- Printed wiring board design and fabrication -- Electronic assemblies -- Interconnections and connectors -- Layout -- Thermal design analysis -- Thermomechanical analysis and design -- Design for vibration and shock -- Humidity and corrosion analysis and design -- Design for reliability -- Electronic materials and properties. | ||
| 520 | |a Handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development | ||
| 650 | 0 | |a Electronic packaging |v Handbooks, manuals, etc. | |
| 700 | 1 | |a Pecht, Michael | |
| 830 | 0 | |a Mechanical engineering (Marcel Dekker, Inc.) |v 76 | |
| 999 | |a vtls000051937 |c 5764 |d 5764 | ||