APA (7th ed.) Citation

Lau. (2000). Low cost flip chip technologies: For DCA,WLSCP,and PBGA assemblies. McGraw-Hill.

Chicago Style (17th ed.) Citation

Lau. Low Cost Flip Chip Technologies: For DCA,WLSCP,and PBGA Assemblies. New York: McGraw-Hill, 2000.

MLA (9th ed.) Citation

Lau. Low Cost Flip Chip Technologies: For DCA,WLSCP,and PBGA Assemblies. McGraw-Hill, 2000.

Warning: These citations may not always be 100% accurate.