Low cost flip chip technologies for DCA,WLSCP,and PBGA assemblies
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| Format: | Book |
| Published: |
New York
McGraw-Hill
2000
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| 100 | 1 | 0 | |a Lau |h John H. |
| 245 | 1 | 0 | |a Low cost flip chip technologies |b for DCA,WLSCP,and PBGA assemblies |c John H. Lau |
| 260 | 0 | 0 | |a New York |b McGraw-Hill |c 2000 |
| 300 | |a xxii,585p. |b ill. |c 23cm | ||
| 500 | 0 | 0 | |a Includes bibliographical references and index |
| 650 | 0 | 0 | |a Multichip modules (microelectronics) |x design and construction |
| 650 | 0 | 0 | |a Microelectronic packaging |
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