Microelectronics failure analysis desk reference
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| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Materials Park, Ohio
ASM International
2019
|
| Edition: | Seventh edition |
| Subjects: | |
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| 003 | MY-KLNDU | ||
| 005 | 20241219044221.0 | ||
| 008 | 210928 20192019ohu b 001 0 eng d | ||
| 020 | |a 9781627082457 (hbk) | ||
| 039 | 9 | |a 202309071019 |b hainim |y 202109280919 |z dewi | |
| 040 | |a MY-KlNDU |b eng |c MY-KlNDU |e rda | ||
| 050 | |a TK 7871 |b .M52 2019 | ||
| 090 | |a TK 7871 |b .M52 2019 | ||
| 245 | 1 | 0 | |a Microelectronics failure analysis |b desk reference |c edited by Tejinder Gandhi |
| 250 | |a Seventh edition | ||
| 264 | 1 | |a Materials Park, Ohio |b ASM International |c 2019 | |
| 264 | 4 | |a © 2019 | |
| 300 | |a xi, 705 pages |b illustrations (some color) |c 28 cm | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 500 | |a "An ASM materials solutions publication." | ||
| 500 | |a "EDFAS, Electronic Device Failure Analysis Society, ASM International." | ||
| 504 | |a Includes bibliographical references and indexes | ||
| 505 | 0 | |a section 1. Failure analysis process and management. Overview of wafer-level electrical failure analysis process for accelerated yield engineering / S.H. Goh, Y.H. Chan, B.L. Yeoh, H. Hao, M.H. Thor, Z. Lin, C.M. Chua, S.H. Tan, L.S. Koh, and W.P. Chua ; Package failure analysis : flow and technique / Tejinder Gandhi and Jason Silva ; Chip-scale packaging and its failure analysis challenges / Susan Xia Li ; Nondestructive techniques for advanced board level failure analysis / Christian Schmidt ; Failure analysis laboratory management principles and practices / Richard J. Ross and Zhiyong Wang -- section 2. Incoming inspection tools. Optical microscopy / John McDonald ; X-ray imaging tools for electronic device failure analysis / Christian Schmidt ; Acoustic microscopy of semiconductor packages / Cheryl D. Hartfield, Thomas M. Moore, and Sebastian Brand -- section 3. Fault isolation. Diagnosis of scan logic and diagnosis driven failure analysis / Srikanth Venkataraman, Martin Keim, and Geir Eide ; Magnetic field imaging for electrical fault isolation / A. Orozco ; Fault isolation using time domain reflectometry, electro optical terahertz pulse reflectometry and time domain transmissometry / Hemachandar Tanukonda Devarajulu, Deepak Goyal, and Mayue Xie ; Frontside sample preparation / Jim Colvin ; Backside preparation and optics / Jim Colvin and Christopher Colvin ; Photon emission in silicon-based integrated circuits / Christian Boit, Anne Beyreuther, and Norbert Herfurth ; Physics of laser-based failure analysis / Felix Beaudoin and Edward Cole, Jr. ; Localizing defects with thermal detection techniques / Paiboon Tangyunyong and Christian Schmidt ; 3D hot-spot localization by lock-in thermography / Sebastian Brand and Frank Altmann ; LADA and SDL : powerful techniques for marginal failures / Dan Bodoh and Kent Erington ; Laser voltage probing of integrated circuits : implementation and impact / Keith A. Serrels and Ulrike Ganesh ; CAD navigation principles / Arpan Bhattacherjee and Martin Parley ; Failure localization with active and passive voltage contrast with FIB and SEM / Ruediger Rosenkranz | |
| 505 | 0 | |a section 4. Device and circuit characterization. Transistor characterization : physics nd instrumentation / Ashok Alagappan ; The fundamentals of nanoprobe analysis / Randal Mulder and Kent Erington ; Silicon device backside deprocessing and fault isolation techniques / Xianghong Tom Tong, Wen-Hsien Chuang, Hyuk Ju Ryu, Prasoon Joshi, Di Xu, Steven R. Cook, Jennifer J. Huening, Yunfel Wang, Shuai Zhao, Piyush Vivek Deshpande, and Zhiyong Ma -- section 5. FIB technique and circuit edit. FIB overview / Chris Park, Amir Avishai, David Pan, Brett Lewis, and Alex Buxbaum ; Role of advanced circuit edit for first silicon debug / Michael DiBattista and T.R. Lundquist -- section 6. Physical analysis. Delayering techniques : dry/wet etch deprocessing and mechanical top-down polishing / Huei Hao Yap and Zhi Jie Lau ; Cross-sectioning : mechanical polishing, ion milling, and focused ion beam / Becky Holdford ; Cross-sectioning : scribing and cleaving / Rebecca D. Dar, Efrat Moyal, and Janet Teshima ; Scanning electron microscopy / W. Vanderlinde ; Energy dispersive x-ray analysis / W. Vanderlinde ; Surface analysis and material characterization techniques used in semiconductor industry to identify and prevent failures / Vladimir Dmitrovic, Rama I. Hegde, Andrew J. Mawer, Rik J. Otte, D. Martin Knotter, and Sven Kayser ; Transmission electron microscopy / Swaminathan Subramanian and Raghaw Rai ; Scanning probe microscopy for nanoscale semiconductor device analysis / Phil Kaszuba -- section 7. Memory failure analysis. DRAM failure analysis and defect localization techniques / Martin Versen ; The power of semiconductor memory failure signature analysis / Cary A. Gloor -- section 8. Special application of failure analysis. Early life failures in automotive : failure analysis and anamnesis, root causes and preventive risk evaluation / Pete Jacob ; Failure analysis and reliability of optoelectronic devices / Robert W. Herrick ; Solar photovoltaic module failure analysis / G.B. Alers ; 2.5D and 3D packaging failure analysis techniques / Douglas Hunt, Pradip Pichumani, Kevin Distelhusrst, and Michael Coster ; Failure analysis techniques and methods for microelectromechanical systems / David E. Grosjean ; Failure analysis of capacitors and inductors / Javaid Qazi and Masahai Ikeda ; Screening for counterfeit electronic parts / Bhanu Sood and Diganta Das -- section 9. Fundamental topics and reference information. Electronics and failure analysis / Jerry Soden, Jaume Segura, and Charles F. Hawkins ; An overview of integrated circuit testing methods / Anne Gottiker, Phil Nigh, and Rob Aitken ; An overview of analog design for test and diagnosis / Stephen Sunter ; Differentiating between EOS and ESD failures for ICs / Leo G. Henry ; Reliability and quality basics for failure analysts / Chris Henderson ; Training needs for the future analyst / Christopher L. Henderson ; Failure analysis terms and definitions / Christopher L. Henderson. | |
| 592 | |b 12/01/2012 |c RM1119.32 |h Bookline Services | ||
| 650 | 0 | |a Electronics |x Materials |x Testing |v Handbooks, manuals, etc | |
| 650 | 0 | |a Microelectronics |x Materials |x Testing |v Handbooks, manuals, etc | |
| 650 | 0 | |a Microelectronics |x Materials |x Defects |v Handbooks, manuals, etc | |
| 650 | 0 | |a Electronic apparatus and appliances |x Testing |v Handbooks, manuals, etc | |
| 650 | 0 | |a Semiconductors |x Defects |v Handbooks, manuals, etc | |
| 999 | |a vtls000100430 |c 87458 |d 87458 | ||