Johnson, R. W., Teng, R. K., & Balde, J. W. (1991). Multichip modules: Systems advantages, major constructions, and materials technologies. IEEE Press.
Chicago Style (17th ed.) CitationJohnson, R. Wayne, Robert K.F Teng, and John W. Balde. Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies. New York, NY: IEEE Press, 1991.
MLA (9th ed.) CitationJohnson, R. Wayne, et al. Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies. IEEE Press, 1991.
Warning: These citations may not always be 100% accurate.