Multichip modules systems advantages, major constructions, and materials technologies
This volume provides the information essential for making the right decisions required for new equipment design.
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| Other Authors: | , , |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York, NY
IEEE Press
1991
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| Series: | IEEE Press selected reprint series
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| Subjects: | |
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| Call Number : | TK 7870.15 .M85 1991 |
MARC
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| 003 | MY-KLNDU | ||
| 005 | 20241220012632.0 | ||
| 008 | 140331 1991 nyua bi 000 0 eng d | ||
| 020 | |a 087942267X | ||
| 039 | 9 | |a 201407161616 |b zul |y 201403311119 |z azraai | |
| 040 | |a UPNM | ||
| 090 | |a TK 7870.15 |b .M85 1991 | ||
| 245 | 0 | 0 | |a Multichip modules |b systems advantages, major constructions, and materials technologies |c edited by R. Wayne Johnson, Robert K.F. Teng, John W. Balde |
| 260 | |a New York, NY |b IEEE Press |c 1991 | ||
| 300 | |a ix, 603 p. |b ill. |c 29 cm. | ||
| 490 | 1 | |a IEEE Press selected reprint series | |
| 504 | |a Includes bibliographical references and index | ||
| 520 | |a This volume provides the information essential for making the right decisions required for new equipment design. | ||
| 650 | 0 | |a Electronic packaging | |
| 650 | 0 | |a Microelectronic packaging | |
| 650 | 0 | |a Multichip modules (Microelectronics) | |
| 700 | 1 | |a Johnson, R. Wayne | |
| 700 | 1 | |a Teng, Robert K.F. | |
| 700 | 1 | |a Balde, John W. | |
| 830 | 0 | |a IEEE Press selected reprint series | |
| 999 | |a vtls000051938 |c 96655 |d 96655 | ||