Introduction to system-on-package (SOP) miniaturization of the entire system
by: Tummala, Rao R., 1942-
Published: (2008)

Low cost flip chip technologies for DCA,WLSCP,and PBGA assemblies
by: Lau
Published: (2000)

Microwave and millimeter-wave electronic packaging
by: Sturdivant, Rick
Published: (2014)

Low cost flip chip technologies for DCA, WLSCP and PBGA assemblies
by: Lau lhJohn H.

Proceedings 1994 IEEE multi-chip module conference MCMC-1994
Published: (1994)

MEMS/MOEMS packaging concepts, designs, materials, and processes
by: Gilleo
Published: (2005)

Area array packaging materials adhesives, pastes and lead-free
by: Gilleo
Published: (2004)

Pencirian antarasambungan pakej mikroelektronik terhadap keadaan sinar gamma terlampau
by: Wan Yusmawati Wan Yusoff
Published: (2014)

Microelectronic system interconnections performance and modeling
Published: (1994)

Microelectronic system interconnections performance and modeling
Published: (1994)

MEMS and microsystems design, manufacture, and nanoscale engineering
by: Hsu, Tai-Ran
Published: (2008)

Advanced MEMS packaging
Published: (2010)

Substrate integrated antennas and arrays
by: Cheng, Yu Jian
Published: (2016)

Packaging of electronic systems a mechanical engineering approach
by: DallylhJames W.

Microelectronics packaging handbook
Published: (1997)

Microelectronics packaging handbook
Published: (1997)

Area array package design techniques in high-density electronics
Published: (2004)

Optoelectronic packaging
Published: (1997)

Electronic packaging, microelectronics, and interconnection dictionary
by: Harper, Charles A.
Published: (1993)

Encyclopedia of thermal packaging.
Published: (2015)

Handbook of electronic package design
Published: (1991)

Mechanical analysis of electronics packaging systems
by: McKeown
Published: (1999)

Proceedings 1994 IEEE multi-chip module conference MCMC-1994
Published: (1994)

Electronic packaging of high speed circuitry
by: Konsowski
Published: (1997)

The handbook of machine soldering SMT and TH
by: Woodgate, Ralph W.
Published: (1996)

Plastics in food packaging properties, design, and fabrication
by: Brown, William E.
Published: (1992)

Wire bonding in microelectronics materials, processes, realibility and yield
by: Harman, George G.
Published: (1997)

Packaging specifications, purchasing, and quality control
by: Leonard, Edmund A.
Published: (1987)

Packaging specifications, puchasing, and quality control
by: Leonard, Edmund A.
Published: (1996)

The Wiley encyclopedia of packaging technology
by: lh

The wiley encyclopedia of packaging technology
by: Brody
Published: (1997)

Microelectronics
by: Razavi, Behzad
Published: (2015)

Microelectronic circuits and devices
by: HorensteinlhMark N.

Food packaging principles and practice
by: Robertson, Gordon L.
Published: (1993)

Introduction to microelectronics to nanoelectronics design and technology
by: Majumder, Manoj Kumar, et al.
Published: (2021)

Fundamentals of microelectronics
by: Razavi, Behzad
Published: (2008)