Microelectronics packaging handbook
Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
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| Other Authors: | , |
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| Format: | Book |
| Language: | English |
| Published: |
New York, NY
Chapman & Hall
1997
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| Edition: | 2nd ed. |
| Subjects: | |
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| Summary: | Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. |
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| Physical Description: | 3 v. ill. 24 cm. |
| Bibliography: | Includes bibliographical references and index |
| ISBN: | 0412084317 (part 1) 0412084414 (part 2) 0412084511 (part 3) |