Microelectronics packaging handbook
Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
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| Other Authors: | , |
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| Format: | Book |
| Language: | English |
| Published: |
New York, NY
Chapman & Hall
1997
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| Edition: | 2nd ed. |
| Subjects: | |
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| LEADER | 00000nam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | 96707 | ||
| 003 | MY-KLNDU | ||
| 005 | 20241220012639.0 | ||
| 008 | 140304 1997 nyua bi 000 0 eng d | ||
| 020 | |a 0412084317 (part 1) | ||
| 020 | |a 0412084414 (part 2) | ||
| 020 | |a 0412084511 (part 3) | ||
| 039 | 9 | |a 201405301050 |b ridzuan |y 201403041547 |z azraai | |
| 040 | |a UPNM | ||
| 090 | |a TK 7874 |b .T774 1997 | ||
| 245 | 0 | 0 | |a Microelectronics packaging handbook |c edited by Rao R. Tummala, Eugene J. Rymaszewski ; managing editor, Alan G. Klopfenstein |
| 250 | |a 2nd ed. | ||
| 260 | |a New York, NY |b Chapman & Hall |c 1997 | ||
| 300 | |a 3 v. |b ill. |c 24 cm. | ||
| 504 | |a Includes bibliographical references and index | ||
| 505 | |a pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging. | ||
| 520 | |a Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. | ||
| 650 | 0 | |a Microelectronic packaging |v Handbooks, manuals, etc. | |
| 700 | 1 | |a Rymaszewski, Eugene J. | |
| 700 | 1 | |a Klopfenstein, Alan G. | |
| 999 | |a vtls000051369 |c 96707 |d 96707 | ||