Encyclopedia of thermal packaging. Set 2 Thermal packaging tools
The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a c...
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| Format: | Book |
| Language: | English |
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Hackensack, NJ Singapore
World Scientific
[2015]
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| 245 | 0 | 0 | |a Encyclopedia of thermal packaging. |n Set 2 |p Thermal packaging tools |c edited by Avram Bar-Cohen |
| 246 | 3 | |a Guide to Cooling of Electronic Equipment | |
| 246 | 3 | |a Thermal Packaging Tools | |
| 264 | 1 | |a Hackensack, NJ |a Singapore |b World Scientific |c [2015] | |
| 264 | 4 | |c ©2015 | |
| 300 | |a 4 volumes |b illustrations |c 26 cm | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index | ||
| 505 | 0 | |a vol.1. Cooling of microelectronics and nanoelectronic equipment: advances and emerging research -- vol.2. Energy optimization and thermal managament of data centers -- vol.3 Compact thermal models of electronic components --vol.4. Thermally-informed design of microelectronic components | |
| 520 | |a The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering. | ||
| 592 | |a JI4860 |b 5/1/16 |c RM7426.00 (set) |h Jendela Informasi | ||
| 650 | 0 | |a Electronic packaging | |
| 650 | 0 | |a Insulation (Heat) | |
| 700 | 1 | |a Bar-Cohen, Avram |d 1946- |e editor | |
| 999 | |a vtls000055772 |c 98125 |d 98125 | ||