Area array packaging processes for BGA, Flip Chip, and CSP
Published: (2004)

Multichip module technology handbook
by: Garrou
Published: (1998)

Advanced MEMS packaging
Published: (2010)

Substrate integrated antennas and arrays
by: Cheng, Yu Jian
Published: (2016)

Low cost flip chip technologies for DCA,WLSCP,and PBGA assemblies
by: Lau
Published: (2000)

Introduction to system-on-package (SOP) miniaturization of the entire system
by: Tummala, Rao R., 1942-
Published: (2008)

Flip chip technologies

Microelectronics packaging handbook
Published: (1997)

Microelectronics packaging handbook
Published: (1997)

Optoelectronic packaging
Published: (1997)

MEMS/MOEMS packaging concepts, designs, materials, and processes
by: Gilleo
Published: (2005)

Area array packaging materials adhesives, pastes and lead-free
by: Gilleo
Published: (2004)

Electronic packaging, microelectronics, and interconnection dictionary
by: Harper, Charles A.
Published: (1993)

Microelectronic system interconnections performance and modeling
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Microelectronic system interconnections performance and modeling
Published: (1994)

Plastics in food packaging properties, design, and fabrication
by: Brown, William E.
Published: (1992)

Packaging specifications, purchasing, and quality control
by: Leonard, Edmund A.
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Packaging specifications, puchasing, and quality control
by: Leonard, Edmund A.
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Microelectronics
by: Razavi, Behzad
Published: (2015)

Microelectronic circuits and devices
by: HorensteinlhMark N.

Low cost flip chip technologies for DCA, WLSCP and PBGA assemblies
by: Lau lhJohn H.

Food packaging principles and practice
by: Robertson, Gordon L.
Published: (1993)

The Wiley encyclopedia of packaging technology
by: lh

The wiley encyclopedia of packaging technology
by: Brody
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Packaging of electronic systems a mechanical engineering approach
by: DallylhJames W.

Microelectronics sensors and devices
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Fundamentals of microelectronics
by: Razavi, Behzad
Published: (2008)

Introduction to microelectronics to nanoelectronics design and technology
by: Majumder, Manoj Kumar, et al.
Published: (2021)

MEMS introduction and fundamentals
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Plastic packaging properties, processing, applications, and regulations
by: Selke, Susan E. M., et al.
Published: (2016)

Area array package design techniques in high-density electronics
Published: (2004)

Wire bonding in microelectronics materials, processes, realibility and yield
by: Harman, George G.
Published: (1997)

Quality control of packaging materials in the pharmaceutical industry
by: Harburn, Kenneth
Published: (1991)

Microelectronic and signal processing advanced concepts and applications
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Encyclopedia of thermal packaging.
Published: (2015)

Microelectronics micro and nano-electronics and photonics
Published: (2009)