Thin film technology handbook
The most comprehensive source available on the preparation, characterization, and emerging applications of thin film. This book features extensive new advances applied in multichip modules (MCMs), and covers the basic principles and applications of thin film deposition techniques for practical use....
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| Format: | Book |
| Language: | English |
| Published: |
New York, NY
McGraw-Hill
c1998
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| Series: | Electronic packaging and interconnection series
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| Subjects: | |
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| Summary: | The most comprehensive source available on the preparation, characterization, and emerging applications of thin film. This book features extensive new advances applied in multichip modules (MCMs), and covers the basic principles and applications of thin film deposition techniques for practical use. It provides and develops design guidelines to realize multilayer structures in microcircuits, thus addressing a critical and rapidly growing area. |
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| Physical Description: | 1 v. (various pagings) ill. 24 cm. |
| Bibliography: | Includes bibliographical references and index |
| ISBN: | 0070190259 |