Thin film technology handbook
The most comprehensive source available on the preparation, characterization, and emerging applications of thin film. This book features extensive new advances applied in multichip modules (MCMs), and covers the basic principles and applications of thin film deposition techniques for practical use....
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| Format: | Book |
| Language: | English |
| Published: |
New York, NY
McGraw-Hill
c1998
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| Series: | Electronic packaging and interconnection series
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| Subjects: | |
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| 001 | 99959 | ||
| 003 | MY-KLNDU | ||
| 005 | 20241220025317.0 | ||
| 008 | 140328 1998 nyua bfi 000 0 eng d | ||
| 020 | |a 0070190259 | ||
| 039 | 9 | |a 201408211441 |b sani |y 201403280906 |z azraai | |
| 040 | |a UPNM | ||
| 090 | |a TK 7872.T55 |b E47 1998 | ||
| 100 | 1 | |a Elshabini-Riad, Aicha | |
| 245 | 1 | 0 | |a Thin film technology handbook |c Aicha A.R. Elshabini-Riad, Fred D. Barlow III |
| 260 | |a New York, NY |b McGraw-Hill |c c1998 | ||
| 300 | |a 1 v. (various pagings) |b ill. |c 24 cm. | ||
| 490 | 1 | |a Electronic packaging and interconnection series | |
| 504 | |a Includes bibliographical references and index | ||
| 505 | |a Film Deposition Techniques and Processes -- Pattern Generation Techniques -- Properties of Thin Film Materials -- Principles and Properties of Semiconductor Thin Films -- Design Guidelines for Thin Film Components and Construction of Thin Film Modules -- Characterization of Semiconductor Thin Films': A Compendium of Techniques -- Diamond Films -- Thin Film Optical Materials -- Thin Film Packaging and Interconnect -- Thin Film for Microwave Hybrids -- Yield, Testing, and Reliability | ||
| 520 | |a The most comprehensive source available on the preparation, characterization, and emerging applications of thin film. This book features extensive new advances applied in multichip modules (MCMs), and covers the basic principles and applications of thin film deposition techniques for practical use. It provides and develops design guidelines to realize multilayer structures in microcircuits, thus addressing a critical and rapidly growing area. | ||
| 650 | 0 | |a Thin film devices |x design and construction | |
| 650 | 0 | |a Thin films | |
| 650 | 0 | |a Electronic packaging | |
| 700 | 1 | |a Barlow, Fred D. | |
| 830 | 0 | |a Electronic packaging and interconnection series | |
| 999 | |a vtls000051925 |c 99959 |d 99959 | ||