Showing
1 - 2
results of
2
Skip to content
library@upnm.edu.my
+6 03-9051 3400
UPNM Library Explorer
Home
Advanced Search
Contact
Login
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Page will reload when a filter is removed.
Reset Filters
Applied Filters:
Suggested Topics:
Remove Filter
Failures
Page will reload when a filter is removed.
Reset Filters
Show filters (1)
Suggested Topics:
Remove Filter
Failures
Search Results
Search Results
Suggested Topics within your search.
Suggested Topics within your search.
Failures
Semiconductors
2
Electronic packaging
1
Production control
1
Reliabiligy
1
Testing
1
Wire bonding (Electronic packaging)
1
defects
1
electronic packaging
1
Showing
1 - 2
results of
2
Refine Results
Sort
Relevance
Date Descending
Date Ascending
Call Number
Author
Title
1
Wire bonding in microelectronics materials, processes, realibility and yield
by
Harman, George G.
Published 1997
Located:
Loading…
Call Number:
TK 7836 .H366 1997
Book
Loading…
Standalone Record
Save to List
Saved in:
2
Integrated circuit failure analysis a guide to preparation techniques
by
Beck, Friedrich
Published 1998
Located:
Loading…
Call Number:
TK 7871.852 .B43 1998
Book
Loading…
Standalone Record
Save to List
Saved in:
Search Tools:
RSS Feed
Email Search
Save Search
Back
Refine Results
Page will reload when a filter is selected or excluded.
Institution
Universiti Pertahanan Nasional Malaysia
2 results
2
Library
Perpustakaan Jeneral Tun Ibrahim
2 results
2
Collection
Library Catalog
2 results
2
Format
Book
2 results
2
Call Number
T - Technology
2 results
2
Author
Beck, Friedrich
1 results
1
Harman, George G.
1 results
1
Language
English
2 results
2
Year of Publication
From:
To:
