Microwave and millimeter-wave electronic packaging by Sturdivant, Rick

Flip chip technologies

MEMS/MOEMS packaging concepts, designs, materials, and processes by Gilleo

Introduction to system-on-package (SOP) miniaturization of the entire system by Tummala, Rao R., 1942-

Optoelectronic packaging

Electronic packaging, microelectronics, and interconnection dictionary by Harper, Charles A.

Area array packaging materials adhesives, pastes and lead-free by Gilleo

Area array packaging processes for BGA, Flip Chip, and CSP

Advanced MEMS packaging

McGraw-Hill
NetLibrary
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MEMS and microsystems design, manufacture, and nanoscale engineering by Hsu, Tai-Ran

Multichip modules systems advantages, major constructions, and materials technologies

Microelectronic system interconnections performance and modeling

Microelectronics packaging handbook

Low cost flip chip technologies for DCA,WLSCP,and PBGA assemblies by Lau

Multichip module technology handbook by Garrou

Multichip modules systems advantages, major constructions, and materials technologies

Microelectronic system interconnections performance and modeling

Microelectronics packaging handbook

Substrate integrated antennas and arrays by Cheng, Yu Jian

Pencirian antarasambungan pakej mikroelektronik terhadap keadaan sinar gamma terlampau by Wan Yusmawati Wan Yusoff