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  1. 1
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    Area array packaging processes for BGA, Flip Chip, and CSP

    Published 2004
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  2. 2
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    Routing in the third dimension from VLSI chips to MCMs by Sherwani, Naveed

    Published 1995
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  3. 3
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    Multichip modules systems advantages, major constructions, and materials technologies

    Published 1991
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  4. 4
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    Microelectronic system interconnections performance and modeling

    Published 1994
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  5. 5
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    Multichip modules systems advantages, major constructions, and materials technologies

    Published 1991
    Book

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  6. 6
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    Microelectronic system interconnections performance and modeling

    Published 1994
    Book

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