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Multichip modules (microelectronics)
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Microelectronic packaging
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Multichip modules (microelectronics)
design and construction
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Flip chip technologies
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Call Number:
TK 7874 F5897 1995
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2
Introduction to system-on-package (SOP) miniaturization of the entire system
by
Tummala, Rao R., 1942-
Published 2008
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TK7870.15 .T86 2008
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Low cost flip chip technologies for DCA,WLSCP,and PBGA assemblies
by
Lau
Published 2000
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TK 7874. L3168 2000
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Institution
Universiti Pertahanan Nasional Malaysia
3 results
3
Library
Perpustakaan Jeneral Tun Ibrahim
3 results
3
Collection
Library Catalog
3 results
3
Format
Book
3 results
3
Call Number
T - Technology
3 results
3
Author
Lau
2 results
2
Swaminathan, Madhavan
1 results
1
Tummala, Rao R., 1942-
1 results
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Language
English
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