Search Results - "Microelectronic"
Suggested Topics within your search.
Suggested Topics within your search.
- Microelectronics 26
- Microelectronic packaging 20
- Multichip modules (Microelectronics) 6
- design and construction 6
- Integrated circuits 5
- Design and construction 4
- Materials 4
- Microelectromechanical systems 4
- Microelectronics industry 4
- Nanotechnology 4
- Electronic apparatus and appliances 3
- Electronic packaging 3
- Electronics 3
- Multichip modules (microelectronics) 3
- Nanoelectronics 3
- Semiconductors 3
- Joints 2
- Mathematical models 2
- Optical fibers 2
- Optoelectronic devices 2
- Ball grid array technology 1
- Case studies 1
- Chemical vapor deposition 1
- Competition 1
- Computer industrial 1
- Computer industry 1
- Computer-aided design 1
- Congresses 1
- Data processing 1
- Defects 1
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Microwave and millimeter-wave electronic packaging
Published 2014Subjects: “…Microelectronic packaging.…”
Book -
2
Pencirian antarasambungan pakej mikroelektronik terhadap keadaan sinar gamma terlampau
Published 2014Subjects: “…Microelectronic packaging…”
Book -
3
Advanced MEMS packaging
Published 2010Subjects: “…Microelectronic packaging.…”
McGraw-Hill
NetLibrary
MyiLibrary
ebrary
Electronic eBook -
4
Substrate integrated antennas and arrays
Published 2016Subjects: “…Microelectronic packaging…”
Book -
5
Area array packaging processes for BGA, Flip Chip, and CSP
Published 2004Subjects: “…Microelectronic packaging.…”
Book -
6
MEMS and microsystems design, manufacture, and nanoscale engineering
Published 2008Subjects: “…Microelectronics…”
Book -
7
Microelectronics packaging handbook
Published 1997Subjects: “…Microelectronic packaging Handbooks, manuals, etc.…”
Book -
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Microelectronics packaging handbook
Published 1997Subjects: “…Microelectronic packaging Handbooks, manuals, etc.…”
Book -
10
MEMS/MOEMS packaging concepts, designs, materials, and processes
Published 2005Subjects: “…Microelectronic packaging…”
Book -
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12
Area array packaging materials adhesives, pastes and lead-free
Published 2004Subjects: “…Microelectronic packaging…”
Book -
13
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14
Introduction to system-on-package (SOP) miniaturization of the entire system
Published 2008Subjects: “…Microelectronic packaging.…”
Book -
15
Multichip modules systems advantages, major constructions, and materials technologies
Published 1991Subjects: “…Microelectronic packaging…”
Book -
16
Low cost flip chip technologies for DCA,WLSCP,and PBGA assemblies
Published 2000Subjects: “…Microelectronic packaging…”
Book -
17
Multichip modules systems advantages, major constructions, and materials technologies
Published 1991Subjects: “…Microelectronic packaging…”
Book -
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