Chemical mechanical planarization of microelectronic materials
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal p...
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| Format: | Book |
| Language: | English |
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New York
Wiley-Interscience
1996
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| 100 | 1 | |a Steigerwald, Joseph M. | |
| 245 | 1 | 0 | |a Chemical mechanical planarization of microelectronic materials |c Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann |
| 260 | |a New York |b Wiley-Interscience |c 1996 | ||
| 300 | |a xiii, 324 p. |b ill. |c 24 cm | ||
| 504 | |a Includes bibliographical references and index | ||
| 505 | 0 | |a 1. Chemical Mechanical Planarization : An Introduction -- 2. Historical Motivations for CMP -- 3. CMP Variables and Manipulations -- 4. Mechanical and Electrochemical Concepts for CMP -- 5. Oxide CMP Processes : Mechanisms and Models -- 6. Tungsten and CMP Processes -- 7. Copper CMP -- 8. CMP of Other Materials and New CMP Applications -- 9. Post-CMP Cleanup -- Appendix. Problem Sets. | |
| 520 | |a Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. | ||
| 650 | 0 | |a Microelectronics |x Materials | |
| 650 | 0 | |a Grinding and polishing | |
| 700 | 1 | |a Murarka, S. P. | |
| 700 | 1 | |a Gutmann, Ronald J. | |
| 999 | |a vtls000018649 |c 18486 |d 18486 | ||