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Chemical mechanical planarization of microelectronic materials

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal p...

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Bibliographic Details
Main Author: Steigerwald, Joseph M.
Other Authors: Murarka, S. P., Gutmann, Ronald J.
Format: Book
Language:English
Published: New York Wiley-Interscience 1996
Subjects:
Microelectronics > Materials
Grinding and polishing
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Table of Contents:
  • 1. Chemical Mechanical Planarization : An Introduction
  • 2. Historical Motivations for CMP
  • 3. CMP Variables and Manipulations
  • 4. Mechanical and Electrochemical Concepts for CMP
  • 5. Oxide CMP Processes : Mechanisms and Models
  • 6. Tungsten and CMP Processes
  • 7. Copper CMP
  • 8. CMP of Other Materials and New CMP Applications
  • 9. Post-CMP Cleanup
  • Appendix. Problem Sets.

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