Area array packaging processes for BGA, Flip Chip, and CSP

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

Bibliographic Details

Other Authors:	Gilleo, Ken
Format:	Book
Language:	English
Published:	New York McGraw-Hill 2004.
Subjects:	Microelectronic packaging. Multichip modules (Microelectronics).
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