APA (7th ed.) Citation

Gilleo, K. (2004). Area array packaging processes for BGA, Flip Chip, and CSP. McGraw-Hill.

Chicago Style (17th ed.) Citation

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. New York: McGraw-Hill, 2004.

MLA (9th ed.) Citation

Gilleo, Ken. Area Array Packaging Processes for BGA, Flip Chip, and CSP. McGraw-Hill, 2004.

Warning: These citations may not always be 100% accurate.