Area array packaging processes for BGA, Flip Chip, and CSP
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
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| Format: | Book |
| Language: | English |
| Published: |
New York
McGraw-Hill
2004.
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| Summary: | This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products. |
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| Physical Description: | x, 260 p. ill. 25 cm. |
| Bibliography: | Includes bibliographical reference and index |
| ISBN: | 0071428291 (hbk) |