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Area array packaging processes for BGA, Flip Chip, and CSP

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

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Bibliographic Details
Other Authors: Gilleo, Ken
Format: Book
Language:English
Published: New York McGraw-Hill 2004.
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics).
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040 |a UPNM 
090 |a TK 7874  |b .A743 2004 
245 0 0 |a Area array packaging processes for BGA, Flip Chip, and CSP  |c Ken Gilleo, editor. 
260 |a New York  |b McGraw-Hill  |c 2004. 
300 |a x, 260 p.  |b ill.  |c 25 cm. 
504 |a Includes bibliographical reference and index 
505 0 0 |g Ch. 1.  |t Next-Generation Flip Chip Materials and Processing --  |g Ch. 2.  |t Flip Chip Assembly and Underfilling --  |g Ch. 3.  |t BGA and CSP Rework: What Is Involved? --  |g Ch. 4.  |t BGA Assembly Reliability --  |g Ch. 5.  |t Die Attach and Rework --  |g Ch. 6.  |t Liquid Encapsulation Equipment and Processes --  |g Ch. 7.  |t Molding for Area Array Packages. 
520 |a This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products. 
592 |b 08/05/2013  |c RM519.30  |h BL 
650 0 |a Microelectronic packaging. 
650 0 |a Multichip modules (Microelectronics). 
700 1 |a Gilleo, Ken. 
999 |a vtls000003708  |c 3555  |d 3555 

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