Area array packaging processes for BGA, Flip Chip, and CSP
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
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| Format: | Book |
| Language: | English |
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New York
McGraw-Hill
2004.
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Table of Contents:
- Ch. 1. Next-Generation Flip Chip Materials and Processing
- Ch. 2. Flip Chip Assembly and Underfilling
- Ch. 3. BGA and CSP Rework: What Is Involved?
- Ch. 4. BGA Assembly Reliability
- Ch. 5. Die Attach and Rework
- Ch. 6. Liquid Encapsulation Equipment and Processes
- Ch. 7. Molding for Area Array Packages.