Microelectronics packaging handbook
Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
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| Other Authors: | , |
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| Format: | Book |
| Language: | English |
| Published: |
New York, NY
Chapman & Hall
1997
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| Edition: | 2nd ed. |
| Subjects: | |
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Perpustakaan Jeneral Tun Ibrahim
| Call Number: |
ref TK 7874 .T774 1997 v.2 ref TK 7874 .T774 1997 v.2 c.2 ref TK 7874 .T774 1997 v.3 |
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