Microelectronics packaging handbook

Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.

Bibliographic Details

Other Authors:	Rymaszewski, Eugene J., Klopfenstein, Alan G.
Format:	Book
Language:	English
Published:	New York, NY Chapman & Hall 1997
Edition:	2nd ed.
Subjects:	Microelectronic packaging > Handbooks, manuals, etc.
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