3D IC and RF SiPs advanced stacking and planar solutions for 5G mobility

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Bibliographic Details
Main Authors:	Hwang, Lih-Tyng (Author), Horng, Tzyy-sheng Jason (Author)
Format:	Book
Language:	English
Published:	Hoboken, NJ John Wiley & Sons 2018
Subjects:	Mobile communication systems > Technological innovations
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Perpustakaan Jeneral Tun Ibrahim

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